Product Identification
Micastat is an electrostatic dissipative laminate designed for work surfaces in the manufacture and assembly of static-sensitive electronic components. Micastat offers the user a static safe work surface with the performance of a high pressure decorative laminate.

Micastat offers:

  1. Low electrical resistance. Surface to ground less than 3 x 108 ohms.
  2. Absolute charge drainage and zero voltage suppression. Micastat exhibits no voltage suppression and dissipates a 5,000 volt static charge to zero in less than 0.01 second per FTM-lOlC at 5 to 95 percent relative humidity.
  3. Micastat is postformable but will require a larger radius than standard laminate.
  4. Resistant to most common solvents, hot solder and fluxes.
  5. Micastat is guaranteed to maintain its static control properties.


Product Description
Standard Nominal Sizes
Type
Thickness
Width
Length
Colors*
A28
(in.)
(mm.)
0.028
0.7
30, 36, 48, 60
762, 914, 1219, 1524
96, 120, 144
2438, 3048, 3658
Solids Only
A38
(in.)
(mm.)
0.036
0.9
30, 36, 48, 60
762, 914, 1219, 1524
96, 120, 144
2438, 3048, 3658
Solids Only
*Due to the unique composition of this product, Micastat colors and corresponding colors in standard Pionite are not exact matches. Sample evaluation is recommended.


Finish
Micastat is available in Suede finish only. Suede finish is a low gloss, textured finish with a 60 degree gloss meter reading of 8 + or - 3 gloss units.



Typical Uses
Micastat laminate was developed specifically for surfacing workstations where static-sensitive electronic components are manufactured. They also work well in hospitals, medical facilities, and clean rooms as they provide a surface that will not attract dust or dirt particles.



Postforming Tips
Postforming Tips When working with Micastat, these techniques will produce a quality application.

  1. Proper conditioning of the laminate, substrate, and backing sheet minimizes possible warping, shrinking, or expansion of assembled panels. Ideally, all components should be conditioned at 70 deg. F to 75 deg. F (21 deg. C to 25 deg. C) and 45 to 50 percent relative humidity for 48 hours prior to assembly.

  2. The radiused edge of substrate must be smooth, rounded, and free of irregularities and loose particles.

  3. Lead-in cracks may be minimized by ensuring a smooth cut on the edge of the laminate.

  4. Always bond Micastat to a suitable substrate such medium to high density fiberboard, or particleboard. It should not be glued directly to plaster walls, gypsum wallboard, concrete, or metals.

  5. Recommended adhesives include solvent or water-based contact cement, white glue (PVA), epoxy, and hot melt glue. Consult your adhesive supplier for specific application requirements.

  6. The use of a backing sheet is recommended to minimize warpage. The thickness of the backing sheet should be relatively equal to the thickness of the decorative laminate on the face of the assembly.

  7. The decorative surface to be formed should be heated to a temperature of 325 deg. F to 375 deg. F (165 deg. C to /90 deg. C).

  8. The desired heat-up rate to 325 deg. F (165 deg. C) should be one second for every 0.001" of thickness (i.e., 28 seconds for A28, 36 seconds for A38).

  9. Forming should be accomplished within 5 seconds of achieving~ proper surface temperature.

  10. Heat-up rates of laminate are affected by thickness, color, and finish. Temperatures should be verified by temperature-indicating wax (Tempilaq®).

Fabrication Tips

  1. All saw blades and router bits used for cutting should be carbide tipped. Feed rate should be slow and tool speed should be high. To minimize the development of surface scratches caused by router bits, lubricating the laminate edge with a wax stick is recommended prior to tooling.

  2. Inside corners of cutouts for electrical outlets, sinks, etc., should have a minimum radius of 1/8" (3 mm) and be filed smooth. This reduces the likelihood of stress cracks.

  3. All edges of laminate should be filed smooth with file direction towards substrate to help prevent stress cracks and to minimize chipping.

  4. When nails or screws must be used, it is advisable to first drill an oversized hole through the laminate. This reduces the likelihood of stress cracks.

  5. Micastat is intended for interior use only, and should not be exposed to extreme humidity, continuous sunlight, or temperatures above 275 deg. F (135 deg. C) for extended periods of time.

  6. Work surfaces must be grounded for proper static dissipation.


Technical Information
Physical Properties




Test
 
NEMA
LD 3-1995
Test
Method
TYPICAL
MICASTAT
VALUES
A28
NEMA STD.*
VGP
TYPICAL
MICASTAT
VALUES
A38
NEMA STD.*
HGP
Thickness
(in.)
(mm.)
 
0.028 +or- 0.003
0.7 +or- 0.08
0.028 +or- 0.004
0.7 +or- 0.1
0.036 +or- 0.003
1.0 +or- 0.08
0.039 +or- 0.005
1.0 +or- 0.12
Wear Resistance
(cycles)
3.13
600
400 (min.)
600
400 (min.)
Ball Impact Resistance
(in.)
(mm)
3.8
25
635
20 (min.)
508 (min.)
35
889
30 (min.)
762 (min.)
Dimensional Change
  Machine Direction
  Cross Direction
 
(%)
(%)
3.11
 
0.40
0.80
 
1.10 (max.)
1.40 (max.)
 
0.40
0.80
 
1.10 (max.)
1.40 (max.)
Boiling Water Resistance
 
3.5
Moderate Effect
Slight Effect
Moderate Effect
Slight Effect
High Temperature Resistance
 
3.6
Slight Effect
Slight Effect
Slight Effect
Slight Effect
Cleanability
  Stain 1-10
  Stain 11-15
 
3.4
5
No Effect
No Effect
20 (max.)
No Effect
Moderate Effect
5
No Effect
No Effect
20 (max.)
No Effect
Moderate Effect
Light Resistance
 
3.3
Slight Effect
Slight Effect
Slight Effect
Slight Effect
Appearance
 
3.1
Complies
Complies
Formability
  Outside Radius

  Inside Radius


(in.)
(mm.)
(in.)
(mm.)
3.14
 

1/2
13
3/16
5

1/2 (min.)
13 (min.)
Not Applicable
Not Applicable

5/8
16
3/16
5

5/8 (min.)
16 (min.)
Not Applicable
Not Applicable
Blister Resistance
(sec.)
3.15
50
40 (min.)
60
55 (min.)
*Micastat is not covered by ANSI/NEMA LD3 specifications; however, the physical properties are similar to VGP and HGP grades.


Electrical Properties 

                        8
    RTG less than 3 x 10  ohms                   EOS/ESD-S4
                                                 DIN 53 276 
                        8
    RTT less than 1 x 10 ohms                    EOS/ESD-S4.1
                           5                     ASTM F-150-72 
        greater than 1 x 10 ohms                 NFPA-99

        at 12% R.H.- 50% R.H.

                     8
    RVOL less than 10 ohms                       ASTM D257 

    Charge Decay occurs within .009 seconds      FTMS 101C  METHOD 4046

    Voltage Suppression=0 (max)                  ETS METHOD





Description
The flush mount insert provides an excellent "flush to surface" ground for Micastat ESD laminate. The system uses a straight knurl for optimal electrical contact with the laminate. The flush mount insert system includes all components necessary to ground the laminate. Also included is all the hardware required for the attachment of two banana jacks to the front surface. For easy installation, use the flush mount tool shown below.


Key:

  1. Flat socket cap screw 8-32-1, secures the brass insert into place
  2. Brass insert, 1/2" dia. straight knurl provides electrical connection to the laminate
  3. Washer, Flat, 1/4" ID, 1/2" OD, provides a flat surface for securing ring terminals
  4. Terminal, ring, mechanically connects up to 16 gauge wire to the flush mount insert
  5. Nut, 8-32, used to fasten flush mount insert system together
  6. Dual banana jack terminals, 10' of 22 gauge wire, provides two banana plug connections in front of work surface grounded to the flush mount insert system


Care and Maintenance
Micastat provides a durable surface that is easy to maintain using ordinary care.

The normal Care and Maintenance instructions may be used with this product, with the following addition:

It is important that no film or insulative barrier be left by the cleaning agent as this will reduce the grounding effect of the laminate.

Back to Products Page   -   Back to Top

Panolam Industries  |  Panolam                                                                            2004 Panolam Industries Privacy Policy